Title: Troubleshooting Lenovo V15 G2 ITL: Random POST Failures Linked to RAM and Possible Motherboard Issues
Introduction
Many Lenovo V15 G2 ITL users have encountered perplexing boot and stability problems that can hinder productivity and overall device reliability. Specifically, some users report that their laptops fail to complete Power-On Self Test (POST) unless certain memory modules are removed. This article explores potential causes, diagnostic steps, and preventive considerations for resolving such issues.
Case Overview
A user described experiencing intermittent freezing, blue screens, and complete system crashes on their Lenovo V15 G2 ITL over a period of approximately two and a half years. The problems manifested unpredictably—sometimes after an hour of use, other times after several days—with no clear pattern. Notably, removing a built-in 8GB soldered RAM module allowed the laptop to boot successfully and operate without stability issues. However, reinserting the memory resulted in the laptop failing to POST, sometimes only after multiple reboots. Testing the RAM module on a different Lenovo device confirmed its functionality, pointing towards a hardware fault elsewhere, likely the motherboard or RAM slot.
Understanding the Issue
The behavior suggests a possible fault in the motherboard’s RAM slot or related circuitry rather than the memory module itself. Since the module works fine in another device, the problem may involve:
- Damaged or degraded RAM slot contacts
- Motherboard solder joint issues, possibly exacerbated by physical damage (e.g., torn rubber pads leading to overheating)
- Electrical or grounding problems affecting POST processes
Additionally, physical damage—such as the removal of rubber pads that serve to insulate and manage airflow—could contribute to overheating and subsequent motherboard stress or damage.
Diagnostic Recommendations
- Visual Inspection:
- Carefully examine the RAM slots for bent or corroded contacts.
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Check for signs of burn marks, cracks, or other physical damage on the motherboard near the RAM slots.
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Test with Different RAM Modules:
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Try using a known-good RAM stick to verify if the issue persists across various modules, ruling out compatibility problems.
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Motherboard Evaluation:
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Consider professional diagnosis to assess solder joints, especially around RAM slots and areas affected by heat or physical stress.
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Thermal Assessment:
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Ensure that the cooling system is functional, and no airflow obstructions exist, which could lead to overheating and motherboards stress.
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**Check for Damage from Physical
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